Modernization and Digital Development of Tin Solder Production [Indonesia Tin Industry Conference]

At the Indonesia Critical Minerals Conference & Expo 2025 - 2025 Southeast Asia Tin Industry Conference, hosted by SMM Information & Technology Co., Ltd. (SMM), supported by the Ministry of Foreign Affairs of Indonesia as a government supporter, and co-organized by the Indonesia Nickel Miners Association (APNI), the Jakarta Futures Exchange, and China Coal Resource, Liang Xiaochang, Deputy General Manager of Foshan Juchuang Automation Co., Ltd., elaborated on the "Modernization and Digital Development of Tin Solder Production."

Background and Development Trends of the Tin Solder Industry

Background and Development Trends of the Tin Solder Industry

As one of the crucial materials in electronic manufacturing and assembly processes, the tin solder industry has witnessed a steady upward trend, driven by the growing demand for high-performance and high-reliability solders amid the development of industries such as 5G, intelligent manufacturing, and NEVs. Its development is not only driven by the demands of the electronics industry but also significantly influenced by global environmental protection policies, technological innovations, and changes in market demand.

With the advancement of intelligent manufacturing and Industry 4.0, the tin solder industry is undergoing a profound transformation from traditional production methods to digital and intelligent ones.

1. Traditional Tin Solder Production Model:

Production Method: Primarily based on manual experience, with operations heavily relying on human labor.

Equipment Level: Single-machine operations with low automation levels.

Data Management: Handwritten records or simple spreadsheets, leading to information silos.

Quality Control: Post-production inspection, with delayed problem identification.

Responsiveness: Slow problem response and long adjustment cycles.

Customer Service: Reactive approach with low transparency.

2. Modernized/Digitalized Tin Solder Production Model

Production Method: Intelligent manufacturing with automated linkage control.

Equipment Level: Smart production lines with interconnected and networked equipment.

Data Management: Real-time data acquisition and central database management.

Quality Control: Process monitoring + predictive maintenance, ensuring stable quality.

Responsiveness: Real-time feedback and optimization for rapid iteration.

Customer Service: Proactive reporting and traceability systems to enhance trust.

Automation and Digitalization Technologies in Tin Solder Production

Automated Alloy Proportioning System: A modern automated alloy proportioning system achieves automated batching through precise sensors, controllers, and PLC systems, ensuring that the chemical composition of tin solder consistently meets standards. By utilizing automated feeding equipment, the system automatically adjusts alloy composition based on real-time data, significantly improving production precision and efficiency.

Automated Casting and Pouring Equipment: The casting and pouring processes of tin solder typically involve high temperatures and tedious manual operations. Automated equipment can enhance production efficiency and reduce the risk of human errors and accidents. Automated casting systems can automatically complete the casting process according to preset process parameters (such as temperature, flow rate, etc.). Automatic pouring machines can precisely pour liquid solder into molds, reducing waste and improving production consistency.

Automated Packaging and Inspection: The adoption of automated packaging lines ensures that each product undergoes strict quality checks before entering the market. Intelligent visual inspection systems can quickly detect appearance defects, weight, and dimensions of tin solder, automatically rejecting non-conforming products.

Digital Management System

Intelligent Control System

►PLC (Programmable Logic Controller):

In traditional production processes, equipment operations often rely on manual control, which is not only inefficient but also susceptible to human factors.

A PLC is an industrial control device for digital arithmetic operations that achieves automated control of various aspects of solder production (such as temperature control, flow rate, pressure, etc.) through programming.

In the production process of tin solder, PLCs can control multiple aspects such as furnace temperature, heating rate, and alloy ratio to ensure stability and precision during production.

►SCADA (Supervisory Control and Data Acquisition):

There is an increasing demand for real-time monitoring and remote control, especially for enterprises with multiple factories, where management needs to remotely monitor production conditions.

The SCADA system transmits real-time data to a central control system by installing sensors, actuators, and real-time data acquisition devices at various production stages. This allows production operators to monitor equipment operating status, process parameters, etc. in real time, enabling them to take prompt measures for adjustments.

Tin Solder Market Data and Application Trends

The automation and digitalization technologies in tin solder production are being driven by market demand and are continuously shaping the development landscape of the tin solder industry. Through an analysis of market data and application trends in several dimensions, we can gain an in-depth understanding of the current status and future development direction of the tin solder industry.

Global Tin Solder Market Size and Growth

►Market Size: According to reports from market research institutions, the global tin solder market size was approximately $8 billion in 2023 and is expected to reach $12 billion by 2028, with an average annual growth rate of about 8%.

►Market Growth of Lead-Free Solders:

With the continuous strengthening of environmental protection laws and regulations, the market demand for lead-free tin solder is increasing year by year.

Lead-free solder has become a mainstream product due to its environmental protection properties and compliance with regulations such as the EU's RoHS (Restriction of Hazardous Substances) directive, implemented in 2006, which restricts the use of lead, cadmium, and other hazardous substances.

Technical challenges: Although lead-free solder is environmentally friendly, issues such as its high melting point, poor liquidity, and inconsistent finished product quality have imposed higher technical requirements on production. To improve the performance of lead-free solder, many enterprises are investing in R&D to explore more stable and efficient lead-free solder formulations.

►Future trends and market forecasts:

Growth drivers mainly include the increasing demand for automation and intelligent manufacturing, as well as the rapid development of emerging technologies such as 5G, AI, and the Internet of Things (IoT), all of which place higher demands on the high quality and precision of tin solder.

It is expected that by 2028, with the continuous growth in demand for welding quality and precision in the fields of consumer electronics, automotive electronics (especially EVs), and communications, the tin solder market will continue to expand.

Market applications of intelligent manufacturing and digital production

►Intelligent manufacturing: According to market data, the penetration rate of intelligent manufacturing in the tin solder industry is expected to reach 40% within the next five years. Most producers have already begun to explore ways to improve production efficiency through intelligent means.

►Digital production management: The application of Manufacturing Execution Systems (MES) and Enterprise Resource Planning (ERP) systems is gradually becoming widespread, helping enterprises enhance the transparency of production management, optimize production processes, and reduce inventory and raw material waste.

►Application of big data and AI in production optimization: Through big data technology, tin solder producers can analyze various types of production data to optimize the production process and improve the quality consistency of solder. Data analysis can help identify production bottlenecks, predict equipment failures, and optimize solder formulations. AI and machine learning algorithms can automatically adjust production process parameters to enhance product quality. By learning from historical data, AI can predict potential production issues and prevent them before they occur.

Summary

The modernization and digital development of the tin solder market are being driven by environmental regulations, market demand, and technological advancements. In the coming years, with the widespread adoption of technologies such as intelligent manufacturing, AI, and big data, the tin solder industry will further develop towards greater efficiency, environmental protection, and intelligence. Meanwhile, industry competition will intensify, and enterprises will need to maintain their leading positions in the market through innovation, improved production efficiency, and cost reduction.

Future development and challenges of tin solder

The production of tin solder continues to face new opportunities and challenges in the process of modernization and digital transformation. In the coming years, with technological innovation, changes in market demand, and the continuous strengthening of environmental protection regulations, the tin solder industry will face new development opportunities and a series of challenges.

Future Development Trends

• Intelligent Manufacturing and Automation: Integration with machine learning, robotic welding

• Environmental Protection and Sustainable Development: Low-temperature solder: reducing thermal damage, saving energy and reducing emissions; silver-free solder: cost reduction, large-scale production

• Miniaturization and High Integration: Micro-welding, high-density welding

• Driven by 5G and the Internet of Things (IoT): 5G communication equipment and IoT devices have a high demand for tin solder

• Globalization and Market Segmentation: With the integration of the global economy, the tin solder market will become further segmented. The demand for welding materials will become increasingly diverse across different regions and industries.

Challenges Facing the Industry

Summary

The future of solder production is full of opportunities and challenges. With the gradual introduction of intelligent manufacturing and automation technologies, the production of tin solder will become more efficient and environmentally friendly, meeting increasingly sophisticated market demands. However, the industry will also face challenges such as fluctuations in raw material prices, pressure for technological innovation, and environmental compliance requirements.

In the future, tin solder enterprises need to actively respond to these challenges by adopting technological innovation, optimizing production management, and implementing market segmentation strategies to maintain a leading position in an increasingly competitive market.

In addition, it also elaborated on the introduction of Juchuang's automation products and its R&D roadmap.

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